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Application of equipotential bonding and earthing in buildings with information technology equipment

August 2000

Foreword
Content
Introduction
1 Scope
2 Normative references
3 Definitions and abbreviations

3.1 Definitions
3.2 Abbreviations
3.3 Symbols

4 General requirements

4.1 Safety from electrical hazards
4.2 Signal reference
4.3 Electromagnetic compatibility (EMC)

5 Requirements on bonding networks

5.1 Bonding configurations
5.2 Common bonding network (CBN) within a building
5.3 Bonding network (BN) within an information technology system
5.4 Merging of common bonding network (CBN) and meshed bonding network (MESH-BN)
5.5 Bondinq and routing aspects of cabling within and between bonding networks

6 Requirements for electricity distribution system

6.1 DC distribution system of secondary supply
6.2 DC distribution system of tertiary supply
6.3 AC distribution system and bonding of the protective conductor
6.4 AC distribution system from tertiary power supply

Annex A (normative) Special national conditions

Annex B (informative) Rationale about common bonding network (CBN) co-ordination

Annex C (informative) Rationale for the integration of the DC return conductor into the merging of common bonding network (CBN) and meshed bonding network (MESH-BN)

Bibliography